| Layers: | 1-40 layers |
| Thicker copper: | 0.5-10 0Z |
| Material: | FR4(Shengyi ChinaITEQ,KBA+HZ)HI-TGFR6,Rogers, |
| Solder Mask: | Taconic, Argon, Nalco, Isola and so on |
| Surface finished: | Green, yellow, white, blue, black, red |
| Screen color: | Conventional hasl, lead free hasl, dip tin dip. |
| Type of products: | Immersion silver, hard gold, OSP… |
| Minimum line width/gap: | White, black |
| Minimum Hole Size: | HF Card(High Frequency)and(Radio Frenquency) |
| Annlar minimum ring: | Impendance controlled board HDI board BGA board and Fine pitch |
| Max copper thickness: | 3.5/4mil (laser drill) |
| Min solder mask bridge: | 0.15mm(mechanical drill/4mil(laser drill) |
| Plug Vias Capacity: | 4mil |
